03-11-2014, SCHOTT North America, Inc., SAN FRANCISCO, Calif. and ELMSFORD, N.Y.
SCHOTT’s High-Tech Electronic Packages Enable Maximum Speed Data Transfer in High-Frequency Applications
Detailed measurement data on HTCC feedthroughs for 100 Gbit/s QSFP transceivers and TO PLUS® 28 Gbit/s packages available
The international technology Group SCHOTT enables the development of very fast, next-generation Ethernet transceivers by offering hermetic packages with miniaturized high-temperature co-fired ceramics (HTCC) feedthroughs for 100 Gbit/s Quad Small Form-factor Pluggable (QSFP) transceivers, one of the fastest data communication transceivers on the market. The company also developed design varieties of its high-performance 28 Gbit/s TO PLUS® packages to suit a larger variety of differential and single-ended high-frequency applications. SCHOTT is showcasing its HTCC feedthroughs and its TO PLUS® packages at the Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference (OFC/NFOEC) on March 11 to 13, 2014 in San Francisco (booth #2021).
Recently introduced to the market, the HTCC feedthrough for 4x25 Gbit/sec transceivers in the QSFP footprint is the smallest and the most powerful package available for short-distance communications, allowing for unprecedented data transfer speeds of 28 Gbit/s. It is used in transceivers in fiber optic networks for data communications and enterprise data centers. The product is currently available to customers for qualification.
“Our depth of knowledge in HTCC feedthroughs strengthened the design of this miniature package, which offers a high-density interconnect solution for the radio frequency (RF) interfaces,” explains Joe Hale, North American Director of Sales and Marketing at SCHOTT Electronic Packaging.
TO PLUS®: Larger variety of designs and customized solutions
In addition to its standard portfolio, SCHOTT offers customized TO PLUS® solutions. “For us, the TO PLUS® header is not just a product, it underscores our research and development capability in this domain of high frequency applications,” states Hale. “We can also offer designs of flexible printed circuits (FPC) so that the TO package can be reliably connected to the transceiver board and retain its high-speed transmission properties.”
The 28 Gbit/s TO PLUS® header underscores SCHOTT’s leadership in designing and manufacturing TO packages. It is the only package on the market that enables a data transfer speed of 28 Gbit/s.
The TO PLUS® header combines the advantages of the industry-standard, hermetically sealed TO-CAN package with high-frequency transmission capabilities to create components that provide high throughput rates for large volumes of data in existing structures. Data transmission rates continue to increase, especially in the field of data and telecommunications. The Fibre Channel transmission standard in storage area networks (SANs) requires extremely fast data lines in data processing centers, and thus extremely high data transfer speeds. The new TO PLUS® component meets these demands, and was especially designed for use with vertical cavity surface emitting lasers (VCSEL) as transmitter optical sub-assemblies (TOSA) and receiver optical sub-assemblies (ROSA).
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SCHOTT now offers its 28 Gbit/s TO PLUS® packages in different designs, making them suitable for an expanded variety of differential and single-ended high-frequency applications. Source: SCHOTT.
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