SCHOTT Unveils Thermally Activated Silicon Adhesive for Use in PV and CSP Solar Arrays, UV-LED and Glass-to-Metal Bonding
Deep UV-200 Engineered to be Highly UV Transmissive
January 26, 2010 (at SPIE Photonics West, San Francisco) — SCHOTT North America today unveiled its new Deep UV-200, a one-part thermally activated silicone adhesive, which is well suited for a variety of applications that require high ultraviolet (UV), visible and near infrared (IR) transmission, including photovoltaic and concentrating solar arrays and UV-LED.
“SCHOTT’s Deep UV-200 is an advancement in thermal adhesive technology showing excellent UV stability down to 200 nm,” said Dr. Eric Urruti, Director of Research and Development for SCHOTT North America. “Among its many applications, SCHOTT’s innovative, highly UV transmissive silicon adhesive will enable solar array systems to utilize more sunlight and in turn, generate more energy.”
SCHOTT’s Deep UV-200 has been engineered to have low-gassing, low reactivity to gamma and electron radiation and thermal stability to 220°C. It also bonds well to a wide variety of substrates and has a long shelf life.
Application for the Deep UV-200 is performed at 80° to 100°C by spraying, dipping or casting. Curing is performed at 140° to 180°C for 12 to 24 hours, depending on the flexibility desired (elastic or rigid).