SCHOTT TO 56 PLUS® transistor outline (TO) with enhanced performance for high-speed data rates of 25 Gbit/s
March 23, 2010 (at the Optical Fiber Communication Conference and Exposition in San Diego) - SCHOTT Electronic Packaging today introduced the new high-frequency TO PLUS® transistor outline (TO) with enhanced performance for high-speed data rates of 25 Gbit/s. Using multiple TO PLUS transistor outlines provides the opportunity to use TO based products for 100G Ethernet. The SCHOTT TO PLUS package will also enable end users to keep their costs in check by utilizing existing assembly and manufacturing infrastructure.
“SCHOTT prides itself in offering the most advanced and innovative electronic packaging to its customers,” said Robert Hettler, SCHOTT Research & Development Manager for SCHOTT Electronic’s Optoelectronic Packaging. “Our SCHOTT TO PLUS transistor outline breakthrough not only achieves high performance rates, but its straightforward design will also help end users keep costs in check.”
TO headers have been used in the market for several decades due to their proven reliability and performance. The TO PLUS header line utilizes the same technology to deliver the same kind of reliability. With matched impedance, the headers are able to achieve low insertion and return losses for high data rates of 25 Gbit/s. Because this enhancement is only achieved by a combination of glass, pins and placement, a TO PLUS package can be built from any existing outline of TO headers, such as TO46, TO56, etc. This allows end users to utilize the same mating optical caps and manufacturing techniques and infrastructure.
Download link to a .zip file containing hi-res print quality photographs: ftp://ftp.schottus.com/OFC2010