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03-23-2010, SCHOTT North America

SCHOTT Exhibits Cutting-Edge Electronic Packaging and Optical Components at Optical Fiber Conference

SCHOTT CerTMS HTCC Hybrid Packages, GTMS TO PLUS, SOH, Window and Lens caps
SCHOTT CerTMS HTCC Hybrid Packages, GTMS TO PLUS, SOH, Window and Lens caps
March 23, 2010 (at the Optical Fiber Communication Conference and Exposition in San Diego) – SCHOTT Electronic Packaging is exhibiting several electronic packaging products that meet the market demand for faster transmission speeds at the Optical Fiber Conference (OFC) this week. In addition, SCHOTT’s Advanced Optics group will present a variety of optical glass components.

SCHOTT is exhibiting Transistor Outlines, microelectronic/hybrid packages and aspherical lens caps, which can achieve bandwidth requirements of more than 25 Gbit/s and up to 100 Gbit/s. “SCHOTT takes pride in its cutting-edge, high-quality, customized electronic packaging components,” said Robert Hettler, SCHOTT Research & Development Manager for Optoelectronic Packaging. “Our customers can feel confident that they are getting customized solutions for quality high frequency packages.”

SCHOTT Electronic Packaging is a leading developer and manufacturer of hermetic housings and other components for the reliable, long-term protection of sensitive electronics. SCHOTT’s core electronic packaging technologies are glass-to-metal and ceramic-to-metal sealing, thermal sensing components, and a variety of cutting edge specialty glass competencies. Advanced Optics is a global network of manufacturing facilities integrated from material development to finishing operations, which include high-precision processing and metrology expertise.

Transistor Outlines
SCHOTT Transistor Outlines (TOs) are the industry standard for today’s transceiver technology. Continuous development ensures that increased demands in transmission speed can be met SCHOTT is experienced in the production of TO headers in all conventional, standard designs and sizes, and also manufactures special TO headers according to customer specifications. Used in conjunction with the right cap, TO headers form a totally hermetic seal that offers long-lasting and reliable protection to the components housed within and ensures that the components function properly.

Microelectronic/Hybrid Packages
SCHOTT glass-to-metal sealed (GTMS) and ceramic-to-metal sealed (SCHOTT CerTMS®) microelectronic packages (otherwise known as hybrid packages) are manufactured according to the requirements of the components requiring protection. They fulfill four vital functions: they protect sensitive modules from harsh conditions, provide electronic components with power, transmit the created heat and ensure the efficient transmission of optical signals. SCHOTT’s extensive glass processing capabilities and the in-house design and manufacturing of multilayer ceramic components ensure the use of highly reliable and extremely accurate packages for optoelectronic components for optical signal transmission. These feedthroughs do not have standard designs, because they are designed and produced in close collaboration with customer needs.

Aspherical Lens Caps
SCHOTT molded aspherical lens caps are manufactured using SCHOTT’s glass-to-metal sealing technology to seal molded aspheres to metal caps. They provide high coupling efficiency in regular datacom and telecom applications. Their numerous advantages include: a hermetic seal using proven glass-to-metal sealing technology, high efficiency due to enhanced optical properties and vertical integrated manufacturing, which allows for customer one-stop-shopping.

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Further information
SCHOTT North America
Barbara Augenblick
555 Taxter Road
10523 Elmsford
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Exhibition 2018 PDA Glass Quality Conference, Washington, DC, USA, 01-23 to 01-24-2018
Exhibition SPIE Photonics West, San Francisco, USA, 01-27 to 02-01-2018
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