11-19-2014, SCHOTT North America, Inc., Southbridge, MA
SCHOTT Advances MEMS Technology by Using HermeS® Glass Wafers with Through Glass Vias
The wafers enable reliable and miniaturized packaging of sensitive MEMS devices in industrial, medical, and radio-frequency applications
SCHOTT HermeS® wafers with hermetically sealed, solid through glass vias (TGV): HermeS® glass substrates enable fully gastight and therefore long-term robust enclosures for MEMS devices. The fine-pitched vias allow the reliable conduction of electrical signals and power into and out of the MEMS device. Image: SCHOTT.
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