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SCHOTT North America
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SCHOTT HermeS®Substrate
The SCHOTT HermeS® wafer specially designed for use in Micro-Electro Mechanical Systems (MEMS), offers superior hermeticity and enhanced electrical properties. As fine-pitched vias can be placed directly under the silicon MEMS device, it is an excellent aid to integrated, miniaturized MEMS designs.
Product Description
Packaging MEMS devices is often as demanding, if not more, than a microelectronic package. Requirements such as miniaturization, hermeticity, and performance in challenging environments are just some of the basic needs for a MEMS package.
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SCHOTT HermeS®, a glass substrate with hermetically sealed solid metal vias, is an ideal solution for MEMS. Applying our accumulated experience with glass-to-metal sealing technology, HermeS® provides superior hermeticity, enhanced electrical properties and thermal reliability. It is also compatible with state-of-the-art wafer-scale bonding assembly processes (e.g. anodic, glass frit and solder).
Product Advantages
The HermeS® substrate offers the following advantages
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Miniaturization / reduction in die size / compact design
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Superior reliability and hermeticity
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Wafer-level packaging solution that is compatible with processes such as glass frit, solder and anodic bonding
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Compatible with SMT using BGA or LGA
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CTE matched to silicon
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Direct through wafer electrical connection leads to a compact, simplified and flexible packaging design
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High performance electrical and thermal path to the printed circuit board
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Application-specific advantages, e.g.
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RF: superior electrical properties
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Optical applications: transparency
Applications
HermeS® can be used for a wide variety of MEMS applications such as:
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Sensors (e. g. gyroscope, accelerometers, pressure-, position-, flow-,
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vibration-, RF-, ...)
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RF (e.g. switches, oscillators, filters)
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Optical MEMS (e. g. optical mirrors, micro-optical benches, optical switches, micro-spectrometers)
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Microfluidics (e.g. inkjet heads, microprobes, actuators, valves, pumps
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Si Microphones
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Close up of hermetically sealed metal vias in glass substrate
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Technology
SCHOTT HermeS® uses glass-to-metal sealing (GTMS) technology to provide superior hermeticity in a wafer-scale packaging solution. Please contact us for more information.
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| Wafer size: |
4", 6", 8" |
| Wafer thickness: |
500 ± 20 μm (0.0197” ± 0.00079”)
(Min. 350 μm [0.0138”]) |
| Contact via pitch: |
250μm (0.0098”), 200μm (0.0079”), 150μm (0.0059”)* |
| Contact via diameter: |
100μm (0.0039”), 80μm (0.0032”), 50μm (0.0020”)* |
| Glass: |
SCHOTT BOROFLOAT® 33 (low alkaline glass) |
| Pin: |
Tungsten (W) |
| Hermeticity: |
≤ 1 × 10–9 Pa · m3/sec
[≤ 1 × 10–8mbar/sec]
[≤ 1 × 10–8atm cc/sec] |
| Electric resistance of W: |
5.5μΩcm |
| CTE of B33: |
3.25x10-6/K |
| Dielectric constant of B33: |
4.6 |
| Index Refraction of B33: |
1.47 at 600nm |
| (* : Under development) |
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New Line-up! |
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| Glass material: |
D263TMTeco |
AF32TMTeco |
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| Glass CTE: |
7.2 x 10-6/K |
3.2 x 10-6/K |
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| Via material: |
FeNi (50%) |
Tungsten (W) |
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Forms of Supply and Product Packaging
Please contact us for a detailed discussion about your requirements.
Quality Assurance
For more information, please refer to our quality assurance processes .
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SCHOTT HermeS® Product Flyer
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