HermeS® Hermetic Through Glass Via (TGV) Wafer

SCHOTT HermeS® is a glass substrate with hermetically sealed solid “Through Glass Vias” (TGV). It enables fully gastight and therefore long-term robust enclosures for MEMS devices. The fine-pitched vias allow the reliable conduction of electrical signals and power into and out of the MEMS device. Since HermeS® can be placed directly under the silicon MEMS, it enables miniaturized, fully hermetic 3D Wafer Level Chip Size Packaging (WLCSP).
Exhibitions & Events
13.
March
Exhibition OFC 2018, San Diego, CA, USA, 03-13 to 03-15-2018
17.
September
Exhibition Gastech, Barcelona, Spain, 09-17 to 09-20-2018
13.
November
Exhibition electronica, Munich, Germany, 11-13 to 11-16-2018
Contact
Electronic Packaging
SCHOTT North America, Inc.

15 Wells Street
Southbridge, MA 01550
USA
E-Mail to SCHOTT+1 (508) 765-7450
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