NEC SCHOTT Components Corporation is developing a new 8” high via density wafer that features hermetically sealed electric feedthroughs for micro-electro-mechanical systems and is intending to launch this product in 2010More
Landshut (Germany), June 16, 2009 — Experts from the Indian nuclear industry are coming together in Mumbai on June 19, 2009. Top organizations, including NPCIL, BARC and BHAVINI, will be presenting the current status and the future of the nation’s Nuclear Power Program. The symposium has been organized by the German international technology group SCHOTT, a leading provider of secure and reliable electrical penetrations for safety-critical applications in nuclear power plants worldwide. More
May 20, 2009 (Cary, Illinois) - SCHOTT Elecpac, LLC announced today that it has received qualification as a certified aerospace supplier to the International Aerospace Quality Standard AS9100B with a perfect score. With this new certification, SCHOTT Elecpac, LLC is now certified to bring its high-quality solutions to both the civil and military aviation and aerospace market. More
March 24, 2009 -- SCHOTT Electronic Packaging (EP) has launched a new edition of the “Hermetic Packaging and Sealing Technology” handbook. The updated version continues to provide a good insight into the company’s signature glass-to-metal sealing (GTMS) technology and now includes an overview and technical details of EP’s other hermetic packaging technologies in the portfolio.More