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July

30
MEMS tightly sealed with SCHOTT HermeSTM
NEC SCHOTT Components Corporation is developing a new 8” high via density wafer that features hermetically sealed electric feedthroughs for micro-electro-mechanical systems and is intending to launch this product in 2010 More

July

15
SCHOTT HTCC and LTCC Design Rules now available online!

July

02
New! Zirconium-containing, low refractive glass for dental composites from SCHOTT

June

16
Leading Authorities of the Indian Nuclear Industry and SCHOTT to Discuss about the Safety Technologies for Future Reactors
SCHOTT organizes Nuclear Symposium in Mumbai
Landshut (Germany), June 16, 2009 — Experts from the Indian nuclear industry are coming together in Mumbai on June 19, 2009. Top organizations, including NPCIL, BARC and BHAVINI, will be presenting the current status and the future of the nation’s Nuclear Power Program. The symposium has been organized by the German international technology group SCHOTT, a leading provider of secure and reliable electrical penetrations for safety-critical applications in nuclear power plants worldwide. More

May

20
SCHOTT Elecpac, LLC receives International Aerospace Quality Standard Certification
May 20, 2009 (Cary, Illinois) - SCHOTT Elecpac, LLC announced today that it has received qualification as a certified aerospace supplier to the International Aerospace Quality Standard AS9100B with a perfect score. With this new certification, SCHOTT Elecpac, LLC is now certified to bring its high-quality solutions to both the civil and military aviation and aerospace market. More

Apr

16
SCHOTT Acquires ELECPAC, a division of Wilbrecht Electronics, Inc.
Acquisition expands SCHOTT’s manufacturing portfolio for Electronic Packaging business

Apr

10
SCHOTT’s Electrical Penetration Assemblies for Nuclear Power Plants
Maintenance-free Performance - New product information now available!

Mar

24
SCHOTT Successfully Tests TO 56 PLUS® Packages to 25 Gigabit Capacity
Glass-to-Metal Sealed Packages pass stringent Residual Gas Analysis tests: Ready to serve the increased performance requirements of higher bandwidth

Mar

24
New Hermetic Packaging and Sealing Technology Handbook available
March 24, 2009 -- SCHOTT Electronic Packaging (EP) has launched a new edition of the “Hermetic Packaging and Sealing Technology” handbook. The updated version continues to provide a good insight into the company’s signature glass-to-metal sealing (GTMS) technology and now includes an overview and technical details of EP’s other hermetic packaging technologies in the portfolio. More

Jan

24
SCHOTT’s Electronic Packaging Business Presented with a Special “Supplier Award” by BAE Systems
Large-Scale Feedthroughs on Nuclear Subs Critical to Boat Safety
2008

Feb

25
SCHOTT’s Electronic Packaging Business Launches New Website

Feb

25
SCHOTT TO 56 PLUS® Addresses Growing Demand for 10 G Technologies
  • Exhibit at OFC/NFOEC Demonstrates SCHOTT TO 56 PLUS®’ Support for High Frequency Applications and more I/O
  • No Need for Manufacturers to Update or Alter Their Welding Machines, Bonders, Fiber Couplings and Other Production Line Equipment
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Contact

Electronic Packaging
SCHOTT North America, Inc.

122 Charlton Street
Southbridge, MA 01550
USA
 +1 (508) 765-3370
 +1 (508) 765-3377
E-mail
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Trade Fairs & Events

11-15 to 11-17-2009

American Nuclear Society (ANS) Winter Meeting

Washington, DC

03-23 to 03-25-2010

Optical Fiber Conference (OFC)

San Diego, CA

More trade fairs