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Products for High Frequency Applications

Data communication networks are becoming increasingly faster. However, data can only be transferred at high speed if all of the components involved are designed for operation at high frequencies. Hence, the easiest way to speed up data transfer rates in communication networks is to replace the transmission and reception components. Product Description Transistor Outline (TO) and Hybrid / Micro-electronic Packages Hermetically sealed housings for high frequency components come in a range of designs, and enable large volumes of data to be transmitted in existing structures - particularly in TO packages. We produce customized solutions for these areas of application ranging from high-volume TO packages (SCHOTT TO PLUS®) to customized microelectronic (or hybrid) packages.

Product Advantages SCHOTT TO PLUS® packages are suitable for use for data throughputs of up to 10 GB/s. The advantage to you: SCHOTT TO PLUS® packages are extremely low-loss and feature high-tolerance accuracy and high-frequency connections. SCHOTT TO PLUS® is fully compatible with existing TO caps and with standard assembly processes. Upgrading communication networks A lot of transmission and reception technologies were developed based on the fundamentals of TOs, hence, it is not necessary for communication application manufacturers to change their products, as they can simply upgrade their networks instead. In-house simulation and measurement technology We are a specialist in simulation and measuring technology. Please feel free to contact our experts for an in-depth consultation - from design development to the finished product - about your needs. Applications These high frequency applications are primarily used for data communications. Technology High frequency applications are not really independent structures in themselves, but simply denote the integration of a high-frequency connection into an existing structure. High-frequency packaging development and production is based on the same principles used for conventional TO and microelectronic packages. Please visit our TO product page for more information about TO packages as well as our micro-electronic/ hybrid page for more information about microelectronic packages. Features / Specifications All products for high frequency applications are produced in close collaboration with our customers. Forms of Supply and Product Packaging All products can be packed individually and supplied on trays. Quality Assurance All our production facilities are ISO 9001 certified. In addition, all our products comply with the International Telcordia Specifications, are ROHS compatible and comply with MIL PRF-38534 and MIL STD-883.

NEW! From Sep 2008, SCHOTT has been offering TO 56 PLUS® Transistor Outline (TO) seals which is capable of handling 17GB/s data transmission speeds. In the latest series of tests, concluded in Mar 2009, results confirm that these glass-to-metal sealed packages can surpass bandwidth requirements of more than 25 GB/s. Please refer to this download for more information.

SCHOTT TO PLUS®