High Frequency TO and Microelectronic Packages

Data communication networks are becoming increasingly faster. However, data can only be transferred at high speed if all of the components involved are designed for operation at high frequencies. Hence, the easiest way to speed up data transfer rates in communication networks is to replace the transmission and reception components.

Transistor Outlines (TO) and Microelectronic Packages
Hermetically sealed housings for high frequency components come in a range of designs, and enable large volumes of data to be transmitted in existing structures - particularly in TO packages. We produce customized solutions for these areas of application ranging from high-volume TO headers (TO PLUS®) to customized microelectronic (or hybrid) packages.
Exhibitions & Events
13.
March
Exhibition OFC 2018, San Diego, CA, USA, 03-13 to 03-15-2018
17.
September
Exhibition Gastech, Barcelona, Spain, 09-17 to 09-20-2018
13.
November
Exhibition electronica, Munich, Germany, 11-13 to 11-16-2018
Contact
Electronic Packaging
SCHOTT North America, Inc.

15 Wells Street
Southbridge, MA 01550
USA
E-Mail to SCHOTT+1 (508) 765-7450
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