Microelectronic Packages with Ceramic-to-Metal-Sealing (SCHOTT CerTMS®) 

The current trend of miniaturization in the electronics and communication sectors continues unabatedly. This indicates the growing need for new hermetic sealing solutions to enable increasingly larger volumes of data to be transmitted at high speeds while constantly minimizing the space required to do so. Conventional glass-to-metal sealed feedthroughs are often not up to this task when dealing with extraordinary conductor systems that require more flexible solutions.

SCHOTT ceramic-to-metal sealed microelectronic packages (SCHOTT CerTMS®) use HTCC multilayer ceramic feedthroughs for faster and yet highly resistant data transmission. The hermetically sealed housings offer reliable protection to sensitive components, whether they are used in purely electronic, opto-electronic or microelectronic systems.
Exhibitions & Events
13.
March
Exhibition OFC 2018, San Diego, CA, USA, 03-13 to 03-15-2018
17.
September
Exhibition Gastech, Barcelona, Spain, 09-17 to 09-20-2018
13.
November
Exhibition electronica, Munich, Germany, 11-13 to 11-16-2018
Contact
Electronic Packaging
SCHOTT North America, Inc.

15 Wells Street
Southbridge, MA 01550
USA
E-Mail to SCHOTT+1 (508) 765-7450
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