In addition to the standard types of packaging such as TO packaging, there is a whole range of other opto-electronic applications that require special packaging. These range from individual sensors to switching systems that require total encapsulation. Glass-to-metal sealed (GTMS) microelectronic packages (otherwise known as hybrid packages) are manufactured according to the requirements of the components requiring protection and fulfill three vital functions.
- Provide electronic components with power
- Protect the sensitive modules from harsh environmental conditions
- Ensure the efficient transmission of optical signals