Microelectronic Packages with Glass-to-Metal Sealing (GTMS)

In addition to the standard types of packaging such as TO packaging, there is a whole range of other opto-electronic applications that require special packaging. These range from individual sensors to switching systems that require total encapsulation. Glass-to-metal sealed (GTMS) microelectronic packages (otherwise known as hybrid packages) are manufactured according to the requirements of the components requiring protection and fulfill three vital functions.
 
  • Provide electronic components with power
  • Protect the sensitive modules from harsh environmental conditions
  • Ensure the efficient transmission of optical signals
Exhibitions & Events
13.
March
Exhibition OFC 2018, San Diego, CA, USA, 03-13 to 03-15-2018
17.
September
Exhibition Gastech, Barcelona, Spain, 09-17 to 09-20-2018
13.
November
Exhibition electronica, Munich, Germany, 11-13 to 11-16-2018
Contact
Electronic Packaging
SCHOTT North America, Inc.

15 Wells Street
Southbridge, MA 01550
USA
E-Mail to SCHOTT+1 (508) 765-7450
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