Microelectronic Packages/ Hybrids

The term "hybrid package" or "microelectronic package" refers to the hermetically sealed packaging of encapsulated and non-encapsulated components in one container. In contrast to, for instance TO packages, these packages can be used to package not only a single component, but also several components. The term "microelectronic package" is generally used if it is not possible to protect the component to be encapsulated using standard packaging, due to a special required number or arrangement of feedthroughs.

Microelectronic packaging is used particularly for packaging small- to medium-sized batches of fully electronic circuits. They are used in purely electronic and opto-electronic applications, as well as increasingly in Micro-Electro-Mechanical Systems (MEMS).

We offer three different technical microelectronic packaging solutions:
News, Exhibitions & Events
21.
March
Exhibition Optical Fiber Communication (OFC) Conference & Exhibition, Los Angeles, CA, USA, 03-21 to 03-23-2017
14.
March
Exhibition AAOS (American Academy of Orthopaedic Surgeons), San Diego, CA, USA, 03-14 to 03-18-2017
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