Microelectronic Packages/ Hybrids

The term "hybrid package" or "microelectronic package" refers to the hermetically sealed packaging of encapsulated and non-encapsulated components in one container. In contrast to, for instance TO packages, these packages can be used to package not only a single component, but also several components. The term "microelectronic package" is generally used if it is not possible to protect the component to be encapsulated using standard packaging, due to a special required number or arrangement of feedthroughs.

Microelectronic packaging is used particularly for packaging small- to medium-sized batches of fully electronic circuits. They are used in purely electronic and opto-electronic applications, as well as increasingly in Micro-Electro-Mechanical Systems (MEMS).

We offer three different technical microelectronic packaging solutions:
News, Exhibitions & Events
04.
April
Exhibition Gastech Japan 2017, Tokyo, Japan, 04-04 to 04-07-2017
21.
March
Exhibition IDS 2017, Cologne, Germany, 03-21 to 03-25-2017
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