Microelectronic Substrates with HTCC Multilayer Ceramics

SCHOTT Electronic Packaging is the only company in Europe that supplies all types of hermetic housing technologies. Apart from its signature Glass-to-Metal Sealing technology, SCHOTT has also accumulated strong know-how in the design and manufacture of customized high temperature cofired ceramic packages and substrates (HTCC). SCHOTT is also able to supply low temperature cofired ceramic (LTCC) housings through its partnership with VIA electronic.

Hermetic multilayer ceramic packages and substrates are ideal for more complex packaging solutions, such as micro-electronic-mechanical systems (MEMS) and high frequency applications because such packages are hermetic and enable a large number of electrical feedthroughs within very small spaces.
News, Exhibitions & Events
Exhibition OFC 2018, San Diego, CA, USA, 03-13 to 03-15-2018
Exhibition IBTE 2017, Shenzhen, China, 11-27 to 11-29-2017
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