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Capabilities

Our production lines have integrated all capabilities for the processing of Wafer & Substrates. Here you can find details about our main competences:

Size/Dimensions

SCHOTT offers substrates and wafer in standard sizes of 4”, 5”, 6” and 8” in various shapes (round, squares) with thicknesses from 0.05 to 7.7 mm. (12” at development stage) For special requests differing from these standard dimensions, please contact our sales team. We will be glad to help fulfill your specific inquiry!

Edge Treatment

Our expertise in edge treatment gives you the choise between flat or notch all according to the valid SEMI standards

Polishing/Cleanliness

Our expertise in polishing makes our products unique! Our polishing cabability as one of the “centerpieces” of you processing technology enables productions fulfilling critical demands and highest requirements.

TTV/Parallelism very low total thickness variation <10 µm / 5 µm / 2 µm Defect characteristics: scratch/dig (MIL-0-13830A) 20/10, 10/5 Edge/Chamfer: optimized edge profile as C-shape edge, chamfer 30°/45° Notch and orientation flat according to SEMI-standards Roughness (RMS): < 1.5 nm / < 1 nm

The standard of cleanliness required for all components used in microsystems technology is very high. Cleaning of our special glasses is done in ultrasonic baths.

Structuring

Expertise in Structuring: With the Sandblasting technology and the Ultrasonic drilling process, SCHOTT has established a variety of capabilities to provide specific solutions for structured Glass Wafer.

US-Drilling Sandblasting Wafer thickness range 400 µm up to 3 mm 30 µm up to 1.5 mm Different hole configurations round holes preferable round and rectangular holes, caverns and channels Locational Tolerance +/– 85 µm* +/– 60 µm* Min. Hole Diameter 400 µm 100 µm * Tightened tolerances upon request

Metrology

Zero defect quality can be realized and guaranteed with high qualified measuring equipment such as 3D-coordinate measuring machine, Kugler Interferometer, etc.

Clean Room Packaging

We have the capability of clean room production and all glasses and wafer are inspected under clean room conditions (clean room class 1000) using special measurement and testing instrumentation. Wafer can be packed in professional wafer shipment boxes under clear room condition. Our glasses are then shipped in hermetically sealed trays that enable our customers to use them without delay in their production facilities.

Quality Assurance

Manufacturing facilities are ISO 9001 certified, quality control is also realized according to ISO 9001-2000 and material traceability is guaranteed.