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AF 32^®

AF 32® Applications

AF 32® - Cover glass for Wafer Level Chip Size Packaging

AF 32 is especially well suited for Wafer Level Chip Size Packaging (WLCSP) of image sensors for 12” wafer size. It is alkali-free in synthesis and has a CTE match to silicon, thus it is very suitable for use in semiconductor-related applications. Its high transmittance and availability in thin thickness ensure optimal optical performance of the packaged image sensor. The fact that this glass is available in many different thickness from 0,1 mm to 1,1 mm allows the packaging house to follow the trend for miniaturization without the need of an expensive requalification of a new material. The tight thickness control of +/- 10µm for 8” wafer formats and roughness values below 1 nm RMS eliminate the need for expensive lapping and polishing processes.

AF 32® – Substrate glass for MEMS wafers

AF 32 is especially well suited as substrate glass for MEMS wafers. It is alkali-free in synthesis and has a CTE match to silicon, thus it is very suitable for use in semiconductor-related applications. Its high chemical resistance ensures good results when chemically etched.

AF 32® – Substrate glass for Wafer Level Optics

To build micro-optics on wafer level exact geometries of the base substrate are key. The glass type AF 32 is available in many different thickness from 0,1 – 1,1 mm with tight TTV of +/- 10 µm to support different design solutions for the most efficient lens system. Its smooth surface with roughness values below 1 nm RMS ensure an adhesive surface for multilayer coatings.