SCHOTT FLEXINITY™ - Structured Glass Solutions

SCHOTT’s innovative structuring portfolio for Wafer & Thin Glass

Product Information

With SCHOTT FLEXINITY™, SCHOTT is introducing a brand new, innovative product portfolio, which offers highly accurate and versatile structured glass substrates.

Most of our glass substrates in various thicknesses are available as FLEXINITY™ processed:

D 263^® bio Substrate Glass l D 263^® T eco Thin Glass l MEMpax^® l AF 32^® eco l BOROFLOAT^® 33

Top

Advantages

Position tolerance +/- 25 µm
Feature size tolerance +/- 25 µm
Structure radius >150 µm
Down to 100 µm thickness

Top

Minimum structuring radius	150 µm
Minimum distance between structures	300 µm
Minimum distance to Wafer edge	5 mm

Sensoring / MEMS

High quality and durable pressure sensors require materials with very specific properties. Glass and silicon share one important property: their coefficient of thermal expansion. When joined through anodic bonding, glass and silicon react to temperature changes in the same way, minimizing stresses throughout the bonding interface. Additionally, the surface roughness has to be extremely low, since adhesion strongly depends on surface quality.

As devices, modules and sensors tend to become thinner and lighter, glass substrates need to be as thin as possible to fit seamlessly.

SCHOTT’s structured wafers feature fire-polished surface quality to permit strong bonding, and are available in wafers thinner than a human hair, perfect for use as ultra-small sensors.

SCHOTT FLEXINITY TM for microfluidic applications

Microfluidics

D 263^{^®} bio is easy to structure and can be toughened chemically, making it an ideal choice for applications that need uncompromising optical quality and very high chemical resistance. It can be used as a substrate glass for optical diagnostics, microfluidic components or other consumer and industrial applications.

Top

Technical Details

Please see below the specifications of our preliminarily set up sampling line. Keep in mind that the specs of the fully implemented process are further improved:

Specifications	Value
Thicknesses (depending on glass type)	0.1 mm – 3.8 mm
Wafer size	4"-12" (round and rectangular)
Structuring features:
- Minimum structuring radius	150 µm
- Structure size tolerance	+/- 25 µm
Edge exclusion	≥ 5 mm
Minimum distance between structures	> 300 µm
Position tolerance of structures	< +/- 25 µm
Layout	According to customer specifications and structuring features
Chipping	< 10 µm surface damage around the hole