Mergers and Acquisitions

The M&A department bundles SCHOTT's combined M&A expertise and ensures a professional transaction management. It assumes leadership responsibility for cross-functional transaction teams and involves all necessary internal and external resources with regards to all relevant aspects of a transaction.

What are typical SCHOTT projects with M&A context?
  • Acquisitions
  • Divestitures
  • Joint ventures
  • Strategic alliances with equity participations
  • IPOs

Contact person

Ada Pannke
Ada Pannke
Head of Mergers & Acquisitions

Phone: +49 (0)6131/66-0

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SCHOTT AG to acquire Australian microfluidic expert MINIFAB
Customers to benefit from complementary portfolio of top quality polymer and glass solutions for breakthrough diagnostics applications

SCHOTT AG, a leading international technology group in the areas of specialty glass and glass-ceramics, has entered into a purchase agreement to acquire the Australian microfluidic company MINIFAB Pty Ltd.
SCHOTT invests in AI start-up NNAISENSE
SCHOTT AG, an international technology group in the areas of specialty glass and glass-ceramics has taken a lead role in the Series B financing round of Swiss startup NNAISENSE. More
SCHOTT is lead investor in Canadian Industry 4.0 Big Data expert Smart Skin
Through this investment, SCHOTT is further advancing its know-how in state-of-the-art technologies More
SCHOTT and Primoceler join forces to advance the next generation of ultra-miniature, ultra-reliable medical implants
The technology group SCHOTT has entered into an agreement to acquire Primoceler Oy to expand its hermetic packaging portfolio with pioneering glass micro bonding technology. This process enables the manufacture of vacuum-tight, ultra-miniature electronic and optical devices with superior reliability. Based on laser technology, this state-of-the-art bonding method can be completed without any heat or added materials, allowing device packaging for sensitive electronics made with only transparent materials, such as glass. Offering excellent biocompatibility with new glass types, the technology creates new possibilities for wafer level chip scale packaging (WL-CSP) in a wide range of applications, including medical implants, MEMS devices, and other reliability-critical electronic and optical devices. More
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