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10-08-2013, Southbridge, MA

Miniaturized hermetic HTCC feedthroughs from SCHOTT for 4x25 GBit/sec

Multilayer ceramic for use in QuadSmall Form-Factor Pluggable transceivers for 100 GBit short distance communications
The international technology group SCHOTT has announced that it will be expanding its range of services and product portfolio. The company will now be developing and manufacturing housings for highly sophisticated high-frequency (HF) applications. The latest development from the Electronic Packaging division is a hermetic high-temperature co-fired ceramic (HTCC) feedthrough for 4x25GBit/sec Quad Small Form-Factor Pluggable (QSFP) transceivers. This product will be simultaneously presented at the European Microwave Week 2013 in Nuremberg, Germany (booth 145) and OPTO 2013 in Paris, France (booth 7.2/L5) from October 8 to 10, 2013.
Expertise that ranges from simulation to serial manufacturing: miniaturized high-frequency HTCC feedthroughs from SCHOTT for 4x25 GBit/sec. Source: SCHOTT.
Expertise that ranges from simulation to serial manufacturing: miniaturized high-frequency HTCC feedthroughs from SCHOTT for 4x25 GBit/sec. Source: SCHOTT.

“This higher density, yet more powerful multilayer ceramic is designed for use in QSFP transceivers that transmit 100 Gbit short distance communications,” said Dr. Thomas Zetterer, Development Engineer at SCHOTT Electronic Packaging. The miniaturized HTCC feedthroughs ensure an extremely high density interconnect solution for this HF interface that delivers excellent HF performance. Key areas of application include fiber optic networks for data communications, enterprise data centers, defense and aerospace.

“To our knowledge, no other comparable solution that offers the same high density can be found anywhere else on the market,” added Zetterer.

Expertise from simulation to serial production A total of four differential HF conductor path pairs featuring the appropriate ground lines have been integrated into a space only 5.9 mm in width. “The challenge is really to choose the right sizes for the HF lines within the HTCC design rules on impedance and see to it that channel crosstalk remains low, objectives that we have managed to achieve,” explained Zetterer.

SCHOTT has conducted HF simulations to examine and assess the various execution options with respect to manufacturing viability and HF performance. The company will now be presenting these results in the form of a design with a bandwidth of 30 GHz that offers excellent HF properties with respect to insertion loss, reflection losses and crosstalk without violating the design rules that apply for high-temperature co-fired ceramics. Furthermore, this high-density design can be realized by meeting viable production engineering requirements.

Background information

SCHOTT has established the ideal prerequisites for taking on the challenges of miniaturization and reproducibly manufacturing HTCC HF feedthroughs by using extremely fine conductor paths (up to 80 µm) and the smallest via diameters (100 µm). These feedthroughs are used as key components in more sophisticated hybrid housings that can accommodate interfaces for DC signals, as well as optical, thermal and mechanical interfaces. In addition to HF feedthroughs for use in power electronics, particularly for the latest GaN and SiC chip generations, SCHOTT also offers SMD-enabled feedthroughs and housings designed to transmit data rates of 4x25 GBit/sec and handle long-distance and short-distance data communications. Capabilities such as these position SCHOTT as an outstanding supplier of hermetic housing solutions for high-frequency applications.

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Electronic Packaging, a business unit of the international technology group SCHOTT, is a leading manufacturer of housings and other components for the reliable long-term protection of sensitive electronics. The core technologies are glass-to-metal and ceramic-to-metal sealing (LTCC and HTCC, Low and High Temperature Co-fired Ceramics), thermal sensing components as well as a variety of cutting edge specialty glass competences. With 1,500 employees at five production locations and several competence centers around the world, local customer support and co-developments for individual packaging solutions are at the heart of the business, serving the world’s leading manufacturers in the automotive, data and telecommunication, sensors and semiconductors, consumer electronics, dental care, home appliances, laser as well as security and tracking industries.

SCHOTT is an international technology group with more than 125 years of experience in the areas of specialty glass and materials and advanced technologies. SCHOTT ranks number one in the world with many of its products. Its core markets are the household appliance, pharmaceuticals, electronics, optics, transportation and architecture industries. The company is strongly committed to contributing to its customers’ success and making SCHOTT an important part of people’s lives with high-quality products and intelligent solutions. SCHOTT is committed to managing its business in a sustainable manner and supporting its employees, society and the environment. The SCHOTT Group maintains close proximity to its customers with manufacturing and sales operations in all major markets. Its workforce of around 16,000 employees generated worldwide sales of $2.6 billion (approximately 2.0 billion euros) for the 2011/2012 fiscal year.

Media contact:
Barbara Augenblick

SCHOTT North America, Inc.
Director of Marketing Communications, North America
Phone: +1 914.831.2285
Fax: +1 914.831.2201

Agency Contact:
Mike Lizun

Gregory FCA on behalf of SCHOTT
Office: 610-642-1435
Further information
SCHOTT North America, Inc.
Barbara Augenblick
555 Taxter Road
Elmsford, NY 10523
Phone: 914-831-2285
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