“This higher density, yet more powerful multilayer ceramic is designed for use in QSFP transceivers that transmit 100 Gbit short distance communications,” said Dr. Thomas Zetterer, Development Engineer at SCHOTT Electronic Packaging. The miniaturized HTCC feedthroughs ensure an extremely high density interconnect solution for this HF interface that delivers excellent HF performance. Key areas of application include fiber optic networks for data communications, enterprise data centers, defense and aerospace.

“To our knowledge, no other comparable solution that offers the same high density can be found anywhere else on the market,” added Zetterer.

Expertise from simulation to serial production A total of four differential HF conductor path pairs featuring the appropriate ground lines have been integrated into a space only 5.9 mm in width. “The challenge is really to choose the right sizes for the HF lines within the HTCC design rules on impedance and see to it that channel crosstalk remains low, objectives that we have managed to achieve,” explained Zetterer.

SCHOTT has conducted HF simulations to examine and assess the various execution options with respect to manufacturing viability and HF performance. The company will now be presenting these results in the form of a design with a bandwidth of 30 GHz that offers excellent HF properties with respect to insertion loss, reflection losses and crosstalk without violating the design rules that apply for high-temperature co-fired ceramics. Furthermore, this high-density design can be realized by meeting viable production engineering requirements.

SCHOTT has established the ideal prerequisites for taking on the challenges of miniaturization and reproducibly manufacturing HTCC HF feedthroughs by using extremely fine conductor paths (up to 80 µm) and the smallest via diameters (100 µm). These feedthroughs are used as key components in more sophisticated hybrid housings that can accommodate interfaces for DC signals, as well as optical, thermal and mechanical interfaces. In addition to HF feedthroughs for use in power electronics, particularly for the latest GaN and SiC chip generations, SCHOTT also offers SMD-enabled feedthroughs and housings designed to transmit data rates of 4x25 GBit/sec and handle long-distance and short-distance data communications. Capabilities such as these position SCHOTT as an outstanding supplier of hermetic housing solutions for high-frequency applications.

Download link to a ZIP file that contains the photograph shown in print quality: http://www.schott-pictures.net/presskit/214800.htcc.

More press photographs can be downloaded at: www.schott-pictures.net

Electronic Packaging, a business unit of the international technology group SCHOTT, is a leading manufacturer of housings and other components for the reliable long-term protection of sensitive electronics. The core technologies are glass-to-metal and ceramic-to-metal sealing (LTCC and HTCC, Low and High Temperature Co-fired Ceramics), thermal sensing components as well as a variety of cutting edge specialty glass competences. With 1,500 employees at five production locations and several competence centers around the world, local customer support and co-developments for individual packaging solutions are at the heart of the business, serving the world’s leading manufacturers in the automotive, data and telecommunication, sensors and semiconductors, consumer electronics, dental care, home appliances, laser as well as security and tracking industries.