HermeS® Hermetic Through Glass Via (TGV) Wafer
- Superior reliability of the packaging leads to long term performance of the MEMS device due to higher mechanical, thermal and chemical resistance of glass
- Excellent RF performance, due to low dielectric constant of glass and highly conductive via materials
- Optical transparency of glass enables better processing and quality control during the production process of a MEMS device
- Anodic bonding with Silicon is available
SCHOTT HermeS® enables extremely miniaturized Chip Size Packaging since the Through Glass Vias can be directly attached to the silicon MEMS.
This results in:
~ 80% foot print reduction compared to ceramic package
~ 35% volume reduction compared to ceramic package
Industrial Hermetic MEMS Sensor:
HermeS® enables long-term, reliable and extremely rugged packaging of industrial sensors.
With HermeS®, medical electronics can be packaged robustly to withstand body fluids and sterilization cycles over long periods of time.
HermeS® provides superior RF properties through absolute hermeticity in an extremely miniaturized design.
SCHOTT HermeS® uses glass-to-metal sealing (GTMS) technology to provide superior hermeticity in a wafer-scale packaging solution. Please contact us for more information.
Please contact us for a detailed discussion about your requirements.