Enabling Miniaturized High Frequency Interposers

SCHOTT HermeSⓇ Through Glass Via substrates now available for chip-size RF interposer applications.
HermeS® Through Glass Vias (TGV) wafers are now available with high via density and extremely small via pitch of up to 90.000 vias per wafer in a matrix layout. This opens new possibilities for miniaturized interposers in wafer level chip size packaging (WL-CSP). HermeS® substrates also offer superior RF properties: they combine the low dielectric constant of glass with highly conductive, hermetically-sealed solid metal vias to enable superior electrical and thermal performance.

For further information, please visit the HermeS website or contact us

Exhibitions & Events
Exhibition Gastech, Barcelona, Spain, 09-17 to 09-20-2018
SCHOTT uses Cookies on this Website to enhance the user experience and provide the best possible Service. By continuing to browse the Website, you consent to our use of Cookies.

Dear visitor,

we’d like to invite you to participate in our survey regarding the usability of our web presence. Your feedback is important to us and will help us to further improve our information offer.

Please take the opportunity to share your opinion with us. It will only take 5 min of your time.

Thank you very much!
Your SCHOTT Online Team