DML TEC TO Package

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High performance, miniaturized and economical alternative to box packages

The SCHOTT TEC TO package is a newly developed transistor outline (TO) which is ideal for laser diodes that require a thermoelectric cooler (TEC). The thermoelectric cooler allows for controlled heat dissipation, which leads to regulated and stable laser wavelengths and higher power signal transmission. 

DML TEC TO for single-channel DWDM in 25G CPRI, XGPON OLT Tx and other tunable laser applications.
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Product Features

  • Designed for 25G DFB laser (on TEC)
  • Includes submount with 25ohm impedance G-S-G-S-G traces capable of 25 GBit/s
  • Asymmetric design for mass producibility at affordable prices
  • Potential application in XGPON
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Product Variants

Module
Speed
OSA Type
Fiber
TO Can Description
Function
XFP 25 Gbps Tx SMF 6.0mm dia, 2 x 25-ohm, 7+1 Large space for TEC, 2 TEC pin, Thermistor, MPD, shared MPD &
Thermistor cathode, 2 Signal pins, one gnd pin
                                                            TEC TO
 
TEC TO with patent
                                                          
TEC TO with components
DML TEC TO Header with components
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Product Performance

S11 (dB) – Reflection/Return Loss
DML TEC TO S11 Graph
S21 (dB) – Insertion Loss
DML TEC TO S21 Graph
S11: Better than -10dB @25GHz for speeds of up to 25 Gbps.
S21: 3dB bandwidth better than 25GHz.
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Matched TO cap types

Matched with Lens cap, molded mini Lens, window cap solder type and window cap mold type.
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Don't be shy

Contact our experts, Mr. Robert Hettler and Ms. Amy Soon for more product information by the following mail form and our team will promptly respond to your inquiry

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Electronic Packaging, SCHOTT North America, Inc., promises that all data entered into a web form will only be used for internal purposes.

EP TO Team
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