DML TEC TO Package

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High performance, miniaturized and economical alternative to box packages

The SCHOTT TEC TO package is a newly developed transistor outline (TO) which is ideal for laser diodes that require a thermoelectric cooler (TEC). The thermoelectric cooler allows for controlled heat dissipation, which leads to regulated and stable laser wavelengths and higher power signal transmission. 

DML TEC TO for single-channel DWDM in 25G CPRI, XGPON OLT Tx and other tunable laser applications.

Product Features

  • Designed for 25G DFB laser (on TEC)
  • Includes submount with 25ohm impedance G-S-G-S-G traces capable of 25 GBit/s
  • Asymmetric design for mass producibility at affordable prices
  • Potential application in XGPON

Product Variants

OSA Type
TO Can Description
SFP, SFP+ 25 Gbps Tx SMF 5.6 mm dia, 2 x 25-ohm, 7+1 Large space for TEC, 2 TEC pin, Thermistor, MPD, shared MPD &
Thermistor cathode, 2 Signal pins, one gnd pin
                                                            TEC TO
TEC TO with patent
TEC TO with components
DML TEC TO with components

Product Performance

S11 (dB) – Reflection/Return Loss
S21 (dB) – Insertion Loss
S11: Better than -15dB @25GHz for speeds of up to 25 Gbps.
S21: 3dB bandwidth better than 30GHz.
different ports of DML TEC TO header

Matched TO cap types

Matched with Lens cap, molded mini Lens, window cap solder type and window cap mold type.

Don't be shy

Contact our experts, Mr. Robert Hettler and Ms. Amy Soon for more product information by the following mail form and our team will promptly respond to your inquiry

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Electronic Packaging, SCHOTT North America, Inc., promises that all data entered into a web form will only be used for internal purposes.

EP TO Team
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