TEC TO Package (Flat Type)

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Cooled header for EML applications, economical alternative to box packages

The SCHOTT TEC TO package is a newly developed transistor outline (TO) which is ideal for laser diodes that require a thermoelectric cooler (TEC). The thermoelectric cooler allows for controlled heat dissipation, which leads to regulated and stable laser wavelengths and higher power signal transmission. 

TEC TO (Flat type ) are suitable for active cooling requirements in single-channel DWDM in 10Gb Ethernet, CPRI, XGPON and other tunable laser applications.
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Product Features

  • Potential use in silicon photonics applications
  • Available with Cu heatsink
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TEC TO
TEC TO flat type
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Matched TO cap types

Matched with Lens cap, molded mini Lens, window cap solder type and window cap mold type.
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Don't be shy

Contact our experts, Mr. Robert Hettler and Ms. Amy Soon for more product information by the following mail form and our team will promptly respond to your inquiry

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Electronic Packaging, SCHOTT North America, Inc., promises that all data entered into a web form will only be used for internal purposes.

EP TO Team
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