EML TEC TO Package (Pedestal)
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Cooled header for EML applications, economical alternative to box packages
The SCHOTT TEC TO package is a newly developed transistor outline (TO) which is ideal for laser diodes that require a thermoelectric cooler (TEC). The thermoelectric cooler allows for controlled heat dissipation, which leads to regulated and stable laser wavelengths and higher power signal transmission.
TEC TO (Pedestal) are suitable for EML chips in single-channel DWDM in 10Gb Ethernet, CPRI, XGPON and other tunable laser applications.
TEC TO (Pedestal) are suitable for EML chips in single-channel DWDM in 10Gb Ethernet, CPRI, XGPON and other tunable laser applications.
Product Variants
25G EML Cool Header
TEC TO with components
50G Cooled EML Header
50G Cooled EML Header with components
Product performance of 25G EML cooled header
S11 (dB) – Reflection/Return Loss
S21 (dB) – Insertion Loss
S11: Better than -15dB @30GHz for speeds of up to 25 Gbps.
S21: 3dB bandwidth better than 30GHz.
Product performance of 50G EML cooled header
Header with TEC, FPC and EML Submount
*Simulation based on LD height of 2.5mm
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S11: Better than -15dB @40GHz
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S21: 3dB bandwidth better than 60GHz
56 GBaud PAM4 Eye Diagram with 50G EML chip
Matched TO cap types
Matched with Lens cap, molded mini Lens, window cap solder type and window cap mold type.
For other caps, please visit www.schott.com/epackaging/english/opto/to_caps/index.html
Don't be shy
Contact our experts, Mr. Robert Hettler and Ms. Amy Soon for more product information by the following mail form and our team will promptly respond to your inquiry
Electronic Packaging, SCHOTT North America, Inc., promises that all data entered into a web form will only be used for internal purposes.
