EML TEC TO Package (Pedestal)
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Cooled header for EML applications, economical alternative to box packages
The SCHOTT TEC TO package is a newly developed transistor outline (TO) which is ideal for laser diodes that require a thermoelectric cooler (TEC). The thermoelectric cooler allows for controlled heat dissipation, which leads to regulated and stable laser wavelengths and higher power signal transmission.
TEC TO (Pedestal) are suitable for EML chips in single-channel DWDM in 10Gb Ethernet, CPRI, XGPON and other tunable laser applications.
TEC TO (Pedestal) are suitable for EML chips in single-channel DWDM in 10Gb Ethernet, CPRI, XGPON and other tunable laser applications.
Product Variants
TEC TO
TEC TO with components
Product Performance
S11 (dB) – Reflection/Return Loss
S21 (dB) – Insertion Loss
S11: Better than -15dB @30GHz for speeds of up to 25 Gbps.
S21: 3dB bandwidth better than 30GHz.
Matched TO cap types
Matched with Lens cap, molded mini Lens, window cap solder type and window cap mold type.
For other caps, please visit www.schott.com/epackaging/english/opto/to_caps/index.html
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Electronic Packaging, SCHOTT North America, Inc., promises that all data entered into a web form will only be used for internal purposes.
