Business Unit Electronic Packaging - Technology Overview

Over the decades, we have developed extensive know-how that is particularly important for hermetic packaging and in the field of electronic packaging technology. These include glass or ceramic-to-metal sealing technology and special plating processes for improved surface finishes. Additionally, we are constantly adding to or improving our broad range of special glass materials for electronics and life sciences.

For more information about our electronic packaging technology, please refer to your specific area of interest:
Exhibitions & Events
25.
September
Exhibition Automotive LiDAR 2019, Detroit, MI, USA, 09-25 to 09-26-2019
01.
October
Exhibition European Microwave Week 2019, Paris, France, 10-01 to 10-03-2019
Contact
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Electronic Packaging
SCHOTT North America, Inc.

15 Wells Street
Southbridge, MA 01550
USA
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E-Mail to SCHOTT+1 (508) 765-7450
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